TSMC added four planned semiconductor fabs to its Arizona expansion on July 16, lifting its announced U.S. investment program by $100 billion to $265 billion.
The new fabs were intended for 2-nanometer and more advanced manufacturing, according to the Arizona Commerce Authority. The full plan called for ten fabs, two advanced-packaging facilities and a research and development center.
The expansion built on two earlier commitments: an initial $65 billion program and another $100 billion announced in March 2025. July’s additional $100 billion brought the cumulative plan to $265 billion. Those amounts describe a multiyear investment program, rather than money already spent.
The packaging facilities would extend the campus beyond wafer fabrication. Making chips on a wafer and assembling them into usable packages are separate manufacturing steps; including both addresses more of the production chain than a fab alone.
The ten-fab plan encompassed facilities at different stages. Arizona already had operating production: the state said TSMC’s first fab began volume production using its N4 process in late 2024. Construction of the second fab was complete, with production expected in 2027. The four newly announced fabs were still future additions.
Sources
- Trump Administration Secures an Additional $100 Billion U.S. Semiconductor Manufacturing Investment for a Total of $265 Billion from TSMC — U.S. Department of Commerce / NIST · 2026-07-16.
- TSMC Announces Additional $100 Billion Investment In Arizona — Arizona Commerce Authority · 2026-07-16.